• 1372 Oka Rd. Oka, Quebec, Canada J0N 1E0
okaply-lamination

LAMINATION

The Burkle lamination line operates at impressive speeds. It is capable of overlaying vinyls (.002″ – .008″), papers, foils (23gm. – 80gm.) and fabrics onto substrates such as MDF, particleboard, lauan plywood, gypsum, mende, hardboard, fiberboard and others. Substrate dimensions range from 48″ – 61″ in width, 60″ – 145″ in length and 1/8″ – 1 1/8″ in thickness.
All Adhesives used are solvent free.

ADHESIVE SYSTEMS

Our technology allows us to laminate on virtually any substrate whether is MDF, particle board, OSP or sheetrock.

  • Conventional PVA formulations are used for 23-gram to 50gram papers, as well as 45-gram to 120-gram foils.
  • The resulting bond offers high heat resistance.
  • Pull tests meet or exceed the standards established by the L.M.A. (Laminating Materials Association).
  • Conventional EVA systems are used primarily for lamination of vinyls to gypsum and low-density fiberboard.
  • The resulting bond offers good moisture resistance.
  • Pull test meet or exceed the standards established by the L.M.A.
  • X-Link EVA systems are used for lamination of .004″ – .006″ vinyls to lauan plywood intended for use as RV walls and ceilings.
  • The resulting bond offers excellent moisture, heat and creep resistance;
  • Pull tests meet or exceed the standard established by the L.M.A.
  • X-Link EVA systems are used for lamination of .004″ – .006″ vinyls to lauan plywood intended for use as RV walls and ceilings.
  • The resulting bond offers excellent moisture, heat and creep resistance;
  • Pull tests meet or exceed the standard established by the L.M.A.